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PC(3D CAD) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Jun 24, 2026～Jul 21, 2026
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PC Product List

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Applied AutoDesk Fusion Designer CAE PC

Applied AutoDesk Fusion Designer CAE PC

Consolidating everything needed for 3D manufacturing into one.

An all-in-one package that can handle everything from design to analysis and manufacturing, with software capable of 3D CAD/CAM/CAE simulations. AutoDesk Fusion is software that consolidates all the necessary functions for manufacturing into one package. It includes features for 3D modeling, assembly, 2D drawing creation, analysis functions, and cutting tool path creation (CAM), as well as advanced capabilities for high-quality product design, such as circuit design and generative design tools that utilize AI. Additionally, by leveraging cloud technology, it enables reduced analysis computation time and data sharing that is not limited by location.

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  • Structural Analysis
  • Thermo-fluid analysis
  • Stress Analysis
  • PC

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Applied AutoDesk Inventor Designer CAE PC

Applied AutoDesk Inventor Designer CAE PC

Powerful integrated solution of CAD and simulation.

Inventor Nastran is an embedded finite element analysis (FEA) software integrated into "Inventor" for designers and analysts. It is used for professional-level simulation analysis and virtual prototypes of models designed in CAD. Since it is integrated into Inventor, it allows for analysis while designing, thereby speeding up and improving the efficiency of the design process. With Autodesk Inventor Nastran, you can perform professional-level simulation analysis. Inventor Nastran supports everything from basic FEA to more advanced FEA, and offers various features such as: - Material model analysis - Automatic drop testing - Automatic impact analysis - Automatic generation of neutral plane meshes - Optimization of beam modeling, among others.

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  • Structural Analysis
  • Stress Analysis
  • Thermo-fluid analysis
  • PC

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3D Measurement and Inspection Software PolyWorks Compatible PC

3D Measurement and Inspection Software PolyWorks Compatible PC

Workstation compatible with "PolyWorks Inspector" for comparing 3D point clouds and CAD and performing error analysis.

Industry-standard software that analyzes 3D measurement data and guarantees adherence to design specifications. PolyWorks | Inspector is a three-dimensional inspection and quality control software that can accurately analyze vast amounts of point cloud data obtained from CMMs (Coordinate Measuring Machines), laser scanners, optical scanners, and more, by matching it with CAD models. It is adopted across a wide range of manufacturing sectors, including automotive, aerospace, and precision machinery, contributing to quality assurance and improved production efficiency. ■ Key Features - Point cloud processing capabilities: noise removal, mesh generation, surface reconstruction - CAD matching/verification: error color map display, GD&T (Geometric Dimensioning and Tolerancing) analysis - Automation support: automation of inspection sequences, automatic report generation - Data integration: compatible with SPC (Statistical Process Control) and PLM systems ■ Benefits of Implementation - Quantifies the differences between design and actual products, ensuring product quality - Streamlines inspection processes and eliminates reliance on individual expertise - Builds a digital quality foundation compatible with smart factories To comfortably process vast point clouds and CAD models, a combination with a high-end workstation equipped with a high-performance CPU, professional GPU, and large-capacity memory is optimal.

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  • 3D CAD
  • Rendering software
  • Desktop PC
  • PC

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Original PC with graphics card tailored for specific applications and software.

Original PC with graphics card tailored for specific applications and software.

We offer GPU embedded slim cases, micro tower types, and high-performance mid-tower types!

We offer "original PCs equipped with graphics cards tailored for specific applications and software." For types suitable for CAD, modeling, design, and graphic production, we have a lineup for both 2D and 3D graphics. Additionally, we also provide recommended products for those using design and image editing applications such as Illustrator and Photoshop. 【Lineup】 ■Be-Clia CAD Type-S14-i7-A1000 ■Be-Clia CAD Type-M14-i7-2000 Ada ■Be-Clia CAD Type-M14-i5-4060 ■Be-Clia CAD Type-T14-i9-4000 Ada *For more details, please refer to the PDF materials or feel free to contact us.

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  • Desktop PC
  • PC

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Recommended PC for structural analysis (FEM) software "Simcenter 3D"

Recommended PC for structural analysis (FEM) software "Simcenter 3D"

Recommended PC for structural analysis (FEM) software "Simcenter 3D"

Simcenter 3D is an integrated CAE platform provided by Siemens Digital Industries Software, capable of performing advanced multiphysics analyses such as structural, vibration, thermal, acoustic, motion, and electromagnetic field analyses within a single environment. ■ Integrated Platform It operates on Siemens NX CAD, allowing for a consistent environment for CAD and analysis (CAE), integrating everything from model preparation and mesh generation to simulation execution and visualization. ■ Main Analysis Areas Supported - Structural Analysis (Linear and Nonlinear) Static stress, buckling, creep, contact, etc. - Vibration and Eigenvalue Analysis Mode analysis, frequency response, random response, fatigue evaluation, etc. - Thermal Analysis Conduction, convection, radiation, steady-state and transient thermal distribution analysis. - Acoustic Analysis Sound pressure, noise evaluation, structural-acoustic coupling (Vibro-Acoustic). - Multibody Dynamics (MBD) Mechanism analysis, joints, dynamic load calculations. Hardware Configuration for Comfortable Operation of Simcenter 3D: Workstation.

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  • Structural Analysis
  • Other research software
  • server
  • PC

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Electromagnetic simulation software EMWORKS recommended PC.

Electromagnetic simulation software EMWORKS recommended PC.

Applied Original HPC [Product Information]

Our company has been manufacturing custom order HPC products at our own factory since our establishment. EMWorks provides best-in-class 2D and 3D electromagnetic field analysis software solutions with multiphysics capabilities. Electromagnetic simulation magnetic field and electric field modeling software (EMS) High-frequency simulation antenna and electromagnetic simulation software (HFWorks) Design and simulation of electric motors for SOLIDWORKS users (MotorWizard) 2D simulation of magnetic and electric fields (EMWorks2D), among others, We recommend HPC/Workstation models for EMWorks products. The required specifications for PCs vary greatly depending on the scale of computation, but higher processing power can improve operational efficiency. <Featured Models> ■ Cost-effective model equipped with Xeon Gold 6426 processor for "EMWorks" ■ Model equipped with the astonishing 64 cores and 128 threads! Ultra-high-performance AMD EPYC 7763 processor for "EMWorks" *For more details, please refer to the PDF document.

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  • Magnetic field analysis/electromagnetic wave analysis
  • PC

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Aurora Imaging Library Compatible PC

Aurora Imaging Library Compatible PC

Industrial image processing application "Aurora Imaging Library" compatible PC

The Aurora Imaging Library is an "industrial image processing library with excellent embedded capabilities and stability," characterized by its suitability for system development focused on device integration and control. - Developer: Matrox Imaging, Canada - Overview: A comprehensive software library developed for industrial image processing and machine vision - Availability: Usable through APIs such as C/C++, C#, .NET. GUI-based development is also possible in conjunction with Aurora Design Assistant - Main Features: - Image acquisition and preprocessing (filtering, geometric transformations, etc.) - Pattern matching, dimension measurement, character recognition (OCR) - Color-based inspection, appearance inspection - 3D image processing (stereo, laser, point cloud analysis) - Classification and detection using deep learning (supports NVIDIA GPU) - Characteristics: - Modular, allowing only the necessary functions to be integrated - In SDK format, enabling flexible integration into embedded devices and dedicated equipment - Widely used by inspection equipment manufacturers and for research purposes, with strengths in real-time performance and stability.

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  • Image Processing Software
  • Industrial PCs
  • PC

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Recommended PC for AFDEX by Applied

Recommended PC for AFDEX by Applied

Forging Analysis Simulation System AFDEX Recommended Workstation

A forging analysis simulation that anyone can easily use. AFDEX supports process design by predicting the manufacturability of forged products. AFDEX is a forging simulation software that can predict issues related to forging, from cold forging to hot forging in various settings. It is applicable to forging analysis in all fields and has achieved results even in areas with few industry precedents, such as thread rolling and plate forging. The user interface is intuitive and easy to understand, allowing analyses to be executed with minimal settings, enabling users to immediately benefit from forging simulation upon implementation.

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  • Structural Analysis
  • Mechanism Analysis
  • Stress Analysis
  • PC

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"HALCON 25.05" compatible workstation

"HALCON 25.05" compatible workstation

HALCON Progress 25.05 - Fusion of AI and Rule-Based Image Processing - Compatible PC

HALCON Progress Edition 25.05 is the latest version released on May 27, 2025, and is an evolving software that provides the latest image processing technology every six months. ■Main New Features and Improvements - Enhanced AI has improved 3D recognition, OCR accuracy, and development efficiency. - Non-contact position estimation using CAD-based Deep 3D Matching. - Deep OCR alignment function that withstands inaccurate ROIs. - Code correction function that can achieve high precision for curved QR codes. - An interface that balances compatibility with the latest cameras and ease of use. - Modular development and AI-assisted development support through HDevelopEVO. - Flexible learning control effective in embedded environments.

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  • Image Processing Software
  • Industrial PCs
  • PC

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Applied JSTAMP/NV Recommended PC

Applied JSTAMP/NV Recommended PC

Press Molding Simulation System JSTAMP/NV Recommended Workstation

JSTAMP/NV is an integrated press forming simulation system that supports the entire process from the conceptual stage of mold design to the final stage. JSTAMP is an integrated analysis system specialized for press forming. It features a triple solver equipped with LS-DYNA, JOH/NIKE, and HYSTAMP, achieving significantly higher accuracy and analysis speed compared to traditional methods (implicit method, one-step method). In particular, it is well-equipped with functions for addressing issues such as crack and wrinkle prevention, springback analysis, measurement, and accommodating anticipated shapes.

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  • Structural Analysis
  • Mechanism Analysis
  • Stress Analysis
  • PC

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Gaming Notebook PC "Raider 18 Max HX A2W"

Gaming Notebook PC "Raider 18 Max HX A2W"

A gaming experience with immersive large-screen visuals and performance on par with high-end desktop PCs!

The "Raider 18 Max HX A2W" is a high-end notebook PC from MSI designed as a desktop replacement. The vast display area created by the 18-inch large screen is ideal not only for smooth and highly responsive gaming but also for demanding tasks such as 3D CAD design for vehicles and architecture, VR demonstrations and presentations, as well as game development, execution, and debugging. It maintains high concentration even during long hours of work or play. 【Features】 ■ Supports ultra-fast wireless LAN "Wi-Fi 7" ■ Web camera privacy shutter ■ MSI Center ■ MSI App Player ■ SteelSeries GG ■ Equipped with a large-capacity battery *For more details, please download the PDF or feel free to contact us.

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  • Notebook PC
  • PC

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SECO NXP-Based Industrial 3.5” SBC DORIS

SECO NXP-Based Industrial 3.5” SBC DORIS

SBC-A62-J, NXP i.MX 6 Family, ARM Cortex-A9, onboard DDR3L up to 2GB

Features ■ NXP i.MX 6 Family, equipped with ARM Cortex-A9 processor ■ Dedicated 2D/3D graphics processor ■ Wi-Fi add-on module; up to 28 GPI/Os; CAN Bus ■ Onboard DDR3L up to 2GB ■ OS Linux/Yocto/Android ■ Operating temperature -40 to 85℃ ■ Dimensions 110 x 86.5 mm (4.5” x 3.7”)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • PC

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High-frequency three-dimensional electromagnetic field analysis software 'Ansys HFSS'

High-frequency three-dimensional electromagnetic field analysis software 'Ansys HFSS'

Industry standard for electromagnetic field simulation! High-precision analysis results, reduced design time, and fewer prototypes.

"Ansys HFSS" is a high-frequency three-dimensional electromagnetic field analysis software that can automatically optimize the mesh while performing electromagnetic field analysis. It features multiple methods such as FEM, MoM, and hybrid techniques tailored to the target. Distributed processing using multi-core CPUs/GPUs accelerates large-scale analyses. Additionally, options are available for 3D structures (MCAD) and printed circuit board specialization (HFSS 3D Layout). 【Main Features】 ■ High-precision "Adaptive Auto Mesh" ■ Diverse solver groups ■ HPC (parallel computing) support ■ Two types of GUI (MCAD/Layout) *For more details, please download the PDF or feel free to contact us.

  • Magnetic field analysis/electromagnetic wave analysis
  • PC

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SECO NXP-Based Industrial SBC SANTINO

SECO NXP-Based Industrial SBC SANTINO

NXP i.MX 6 Family, ARM Cortex-A9, onboard 1GB LPDDR4, OS Yocto

Features ■ NXP i.MX 6 Family, equipped with ARM CORTEX-A9 processor ■ GC320 2D accelerator + GC880 3D accelerator ■ 1x 100MbE, 2x USB, 2x RS232, RS485, CAN ■ onboard 1GB LPDDR4 ■ 2D graphics accelerator ■ OpenGL ES 2.0 3D graphics accelerator with a shader ■ 18-bit parallel RGB interface ■ 1x 100MbEthernet, 1x USB 2.0 OTG micro-AB, 1x USB 2.0 Type-A ■ 1x speaker (connector), 2x RS-232, RS-485, 1x CAN (ISO/DIS 11898)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • PC

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CPU module "SMARC" [LEC-IMX95]

CPU module "SMARC" [LEC-IMX95]

NXP i.MX95 equipped SMARC 2.1 short-size module

ADLINK's LEC-IMX95 is a state-of-the-art SMARC revision 2.1 compliant module based on the powerful NXP i.MX95 (Arm Cortex-A55 x6 + Arm Cortex-M7 x1 + Arm Cortex-M33 x1) processor, integrating an ISP and an eIQ Neutron Neural Processing Unit (NPU) that operates at up to 2 TOPS. It features high-performance computing with excellent power efficiency, immersive 3D graphics powered by Arm Mali, an innovative NXP NPU accelerator for machine learning, and capabilities for fast data processing along with safety and security functions.

  • Embedded Board Computers
  • PC

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Applied Moldex3D Recommended PC

Applied Moldex3D Recommended PC

Moldex3D is software with an intuitive interface that can be mastered by both experts in analysis and beginners, offering high reproducibility.

Moldex3D is a three-dimensional resin flow analysis software that boasts a world-class market share. It analyzes the entire mold, including parts, runners, and cooling channels, in three dimensions and reproduces it with high accuracy. In addition to solvers specifically designed for resin flow analysis, such as flow, cooling, and deformation, it offers robust computational features for fiber orientation, stress, and viscoelasticity. It also supports various special molding techniques, enabling efficient solutions for molding defects and optimization of molding conditions. The developer, CoreTech System Co., Ltd., was founded in Taiwan in 1995. Since then, it has led the plastic injection molding industry and continues to provide excellent CAE solutions. Moldex3D is equipped with a variety of optional features in addition to basic analysis functions such as flow, packing pressure, cooling, and deformation (warpage) to meet all the resin flow analysis needs required in design settings. Notably, it features advanced 3D mesh technology-based analysis solvers for fiber orientation and viscoelasticity, an interface with FEA (Finite Element Analysis), analysis tools for molding processes such as hot runners, and modules that support special molding techniques like compression molding and FIM (Fine Bubble Resin Injection Molding).

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  • Structural Analysis
  • Thermo-fluid analysis
  • Mechanism Analysis
  • PC

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ADLINK PXI Express Card PXIe-9848

ADLINK PXI Express Card PXIe-9848

8CH 14Bit Maximum 100MS/s Digitizer

◾Maximum sampling rate of 100 MS/s ◾High-resolution 14-bit ADC ◾Analog input (maximum 100 MHz bandwidth) ◾512MB onboard storage memory ◾High-speed PXI Express bus interface ◾Scatter-Gather DMA data transfer for high-speed data streaming ◾Digital trigger input terminal

  • Expansion Boards
  • PC

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SECO NXP-Based Industrial 3.5” SBC ALBION

SECO NXP-Based Industrial 3.5” SBC ALBION

SBC-C20, NXP i.MX 8M Family, ARM Cortex-A53, onboard DDR3L up to 2GB

Features ■ NXP i.MX 8M Family, based on ARM Cortex-A53 MPCore + Cortex-M4 core platform ■ Integrated graphics Vivante GC400T, 2D and 3D HW accelerators ■ WiFi AC/a/b/g/n + BT LE 5; M.2 WWAN slot; M.2 modem micro SIM slot ■ Onboard DDR3L up to 2GB ■ OS Linux/Android ■ Operating temperature -40 to 85°C (only for boards without WiFi module) ■ Dimensions: 101.6 x 147 mm (4” x 5.78”)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • PC

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SECO NXP-Based Industrial SBC VIKTORIA

SECO NXP-Based Industrial SBC VIKTORIA

SBC-984, NXP i.MX 6 Family, ARM Cortex-A9, onboard DDR3L up to 2GB

Features ■ Equipped with i.MX 6Solo/6DualLite/6Dual/6Quad/6Quad/6Dual processors ■ Onboard DDR3L up to 2GB ■ miniPCI-e slot; CAN Bus; Wi-Fi add-on module ■ Dedicated 2D/3D graphics processor ■ OS: Linux ■ Operating temperature: 0 to 70°C ■ 80 x 67 mm (3.15” x 2.64”)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • PC

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Jetson Nano equipped industrial embedded PC IBOX-JSN0

Jetson Nano equipped industrial embedded PC IBOX-JSN0

LITEMAX, Quad-Core ARM Cortex A57, Maxwell 128NVIDIA CUDA Cores

Features ■ Equipped with 128 NVIDIA CUDA cores and Maxwell GPU architecture, NVIDIA Jetson Nano ■ High AI computing performance through GPU acceleration ■ Supports 9 Ethernet ports (8 PoE, 1 GbE) ■ Supports ONVIF 2.0 and up to 8 channels of 2MP IP cameras ■ Wide operating temperature range of -20°C to +65°C ■ JetPack compatible

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  • Industrial PCs
  • PC

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ADLINK PCI Express Card PCIe-9852

ADLINK PCI Express Card PCIe-9852

2CH 14Bit Maximum 200MS/s Digitizer

Features ◾ Maximum sampling rate of 200 MS/s ◾ High-resolution 14-bit ADC ◾ Analog input (up to 90 MHz bandwidth) ◾ 1GB onboard storage memory ◾ High-speed PCI Express x4 bus interface ◾ Scatter-Gather DMA data transfer for high-speed data streaming ◾ Digital trigger input/output terminals

  • Expansion Boards
  • PC

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SECO NXP-Based Industrial SBC SANTOKA

SECO NXP-Based Industrial SBC SANTOKA

NXP i.MX 6 Family, ARM Cortex-A9, onboard 1GB DDR3L, OS Yocto

Features ■ Processor based on NXP i.MX 6 Family with ARM Cortex-A9 cores ■ GC320 & GC355 2D accelerator + GC2000 3D accelerator ■ 2x 100MbE, up to 3x USB, 2x RS232, RS485, CAN ■ Onboard 1GB DDR3L ■ LVDS Single/Dual Channel connector, HDMI interface, 1x CAN (ISO/DIS 11898) ■ eMMC: 4 GB MLC, SD slot: 4 bit MMC/SDIO/SD/SDHC ■ 2x 100Mb Ethernet mPCIe (half size) socket for modems or WiFi/BT ■ 1x USB 2.0 OTG micro-AB, up to 2x USB 2.0 Type-A ■ 2x RS-232, RS-485, 1x speaker (connector) ■ OS Yocto ■ Size 159x18x80mm

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • PC

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SECO CPU Module Trizeps VIII Plus

SECO CPU Module Trizeps VIII Plus

Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M Plus

Features ■ Equipped with NXPi.MX8MPlus application processor ■ Supports 2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth ■ Integrated GPU with multi-display support GC520L2D accelerator + GC7000UL3D accelerator ■ Onboard LPDDR4-4000 memory up to 8GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • PC

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SECO NXP-Based Industrial SBC ASTRID

SECO NXP-Based Industrial SBC ASTRID

SBC-C61, NXP i.MX 8M Family, ARM Cortex-A53, equipped with LPDDR4-3000 memory.

Features ■ NXP i.MX 8M Mini Family equipped with Arm Cortex-A53 cores + general purpose Cortex-M4 400MHz processor ■ Supports GC320 2D graphics accelerator + GCNanoUltra 3D 2D graphics accelerator ■ Up to 2x GbE; optional Wi-Fi; up to 2x RS-232 or RS-485 or CAN; optional LTE Cat4 modem with SIM slot or eSIM ■ Onboard LPDDR4-3000 up to 4GB ■ Supports LVDS Single/Dual channel, eDP, MIPI-CSI camera connector ■ Compatible with OS Yocto/Android ■ Operating temperature -40 to 85℃ ■ Dimensions 146x102 mm (3.5” form factor)

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • PC

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Core i7 equipped compact fanless PC 'FAE-W1400'

Core i7 equipped compact fanless PC 'FAE-W1400'

It can be used in scenarios that require performance, such as image processing applications, as well as for IoT devices.

The "FAE-W1200" is a compact fanless PC equipped with the Intel Core i7-8665UE from the Whiskey Lake generation. Its fanless design allows it to be installed in various environments. Despite being a Core i7 CPU, it features a highly efficient CPU with a TDP of 15 Watts. It is equipped with Intel's integrated graphics from the Whiskey Lake generation, providing sufficient performance for 3D graphics and 4K output. 【Suitable Applications】 ■ Image processing entry ■ Surveillance camera systems ■ Edge servers *For more details, please visit our website or feel free to contact us.

  • Industrial PCs
  • PC

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UNO-2362G

UNO-2362G

Compact Fanless Embedded PC UNO-2362G

The new UNO-2362G is one of the models in the UNO-2000 series, equipped with daisy-chain network functionality, Advantech's new modular iDoor technology, and the latest AMD dual-core processor. With the integrated daisy-chain LAN technology in the UNO-2362G, users can easily create star or daisy-chain networks without using a network switch and can also connect multiple ADAM modules.

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  • Industrial PCs
  • PC

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Gaming Notebook PC "Thin 15 B13U"

Gaming Notebook PC "Thin 15 B13U"

Equipped with a high-performance dedicated GPU, image processing and 3D CG production are comfortable! The body design is portable with a 15.6-inch screen, a thickness of 21.7mm, and a weight of 1.86kg.

The Thin-15-B13UC-6001JP is an entry-level gaming laptop equipped with a high-performance dedicated GPU, the NVIDIA GeForce RTX 3050 Laptop GPU, and a multitasking-friendly Intel 13th generation CPU, the Core i7-13620H. It is suitable for those engaged in image and video editing, light design work, and game development. <Product Features> 【A Higher Level of Comfort】 Offers comfort that surpasses business laptops with beautiful graphics and smooth visuals unique to high-performance gaming laptops. 【Excellent Cooling and Performance】 Provides cooling performance that efficiently dissipates heat from the CPU and GPU, maintaining high performance even during long hours of intensive use. 【Repair and Support in Japan】 In the event of any issues, a call center and repair center in Japan will respond quickly. MSI has a robust domestic support system. *For more details, please refer to the PDF or feel free to contact us.

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  • Notebook PC
  • PC

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Core i7 equipped compact fanless PC 'FAE-K1200'

Core i7 equipped compact fanless PC 'FAE-K1200'

It demonstrates performance in situations that require high performance, such as image processing and use as an IoT edge server.

The "FAE-K1200" is a compact fanless PC equipped with the Intel Core i7-7600U from the Kabylake generation. Its fanless design allows it to be installed in various environments. Despite being a Core i7 CPU, it features a high-efficiency CPU with a TDP of 15 Watts. It is equipped with Intel's integrated graphics capabilities from the Kabylake generation, providing sufficient performance for 3D graphics and 4K output. 【Suitable Applications】 ■ Image processing entry ■ Surveillance camera systems ■ Edge servers *For more details, please visit our website or feel free to contact us.

  • Industrial PCs
  • PC

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15.6-inch Android Touch Panel PC USC-160

15.6-inch Android Touch Panel PC USC-160

15.6-inch wide multi-touch screen PC with Android, battery-free, making it ideal for long-term use.

The "USC-160" is a 15.6-inch wide multi-touch panel PC. Since it is battery-free, you don't have to worry about battery degradation over time like with tablet devices, allowing for long-term use. The front panel is IP65 compliant, which minimizes concerns about malfunctions due to dirt or water droplets, making it ideal for use in restaurants. The body is slim at 3.5 cm thick, and we offer both a wall mount kit and a stand for stationary use. It can be used in a space-saving manner without a stand or as a display for self-service terminals, adaptable to your layout. It supports both vertical and horizontal orientations, making it effective for signage as well. As a commercial device, it is equipped with a variety of interfaces on the back (USB x 4, COM ports x 2, HDMI, LAN, etc.). These are housed within a cover panel, allowing for neat wiring. We also offer a variety of peripherals such as printers and barcode readers. <Features> - Battery-free, suitable for long-term use. - Front panel has IP65-rated water and dust resistance. - Supports both vertical and horizontal orientations. [Loan units available upon request] [Estimates available]

  • Industrial PCs
  • PC

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